![Lewis Hwan](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Profiel
Lewis Hwan currently works at Mutual-Pak Technology Co., Ltd., as President.
Actieve functies van Lewis Hwan
Bedrijven | Functie | Begin |
---|---|---|
Mutual-Pak Technology Co., Ltd.
![]() Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | President | 01-09-2010 |
Ervaring
Beklede functies
Actief
Inactief
Beursgenoteerde bedrijven
Bedrijven in privébezit
Connecties
Eerstegraads connecties
Bedrijven verbonden in de eerste graad
Man
Vrouw
Besturend
Uitvoerend
Verwante bedrijven
Bedrijven in privébezit | 1 |
---|---|
Mutual-Pak Technology Co., Ltd.
![]() Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |