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Oorsprong van het eerstegraads netwerk van Marcus Crayon
Entiteit | Type entiteit | Industrie | |
---|---|---|---|
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
4
| Subsidiary | Semiconductors | 4 |
Grafiek van bedrijven verbonden in de tweede graad
Connectie in verschillende bedrijven
Bedrijven verbonden met Marcus Crayon via zijn persoonlijke netwerk
Onderneming | Sector | Gelieerde personen | Hoofdpost |
---|---|---|---|
FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal | |
SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
AGC Multi Material America, Inc.
![]() AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President |
Statistieken
Internationaal
Verenigde Staten | 4 |
Sectoraal
Technology Services | 2 |
Utilities | 2 |
Electronic Technology | 2 |
Operationeel
Sales & Marketing | 2 |
President | 2 |
Corporate Officer/Principal | 2 |
Director of Finance/CFO | 1 |
Chief Operating Officer | 1 |
Sterkste connecties
Insiders | |
---|---|
Jay B. Grover | 4 |
Fred Hickman | 1 |
David McComb | 1 |
Greg Marshall | 1 |
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