![Bruce Bowers](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Bruce Bowers
Corporate Officer/Principal bij FlipChip International LLC
Momenteel actieve connecties
Naam | Geslacht | Leeftijd | Verwante bedrijven | Samenwerking |
---|---|---|---|---|
David McComb | M | - |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | 17 jaar |
Janine Schmitz | F | - |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
Steve K. Chen | M | - |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
Zhi Yi Xiao | M | 47 |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
Dawn Cuevas | F | - |
FlipChip International LLC
![]() FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
Relatiegrafiek
Connectie in verschillende bedrijven
Statistieken
Land | Connecties | % van het totaal |
---|---|---|
Verenigde Staten | 5 | 100.00% |
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