Chin Kung Li

Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China.

Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China.

Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China.

Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China.

Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China.