Janine Schmitz
Verkoop & Marketing bij FlipChip International LLC
Momenteel actieve connecties
| Naam | Geslacht | Leeftijd | Verwante bedrijven | Samenwerking |
|---|---|---|---|---|
| David McComb | M | - |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | 17 jaar |
| Bruce Bowers | M | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Steve K. Chen | M | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Zhi Yi Xiao | M | 47 |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Dawn Cuevas | F | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
Relatiegrafiek
Connectie in verschillende bedrijven
Statistieken
| Land | Connecties | % van het totaal |
|---|---|---|
| Verenigde Staten | 5 | 100.00% |
Ouderdom van de connecties
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- Janine Schmitz
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