Patty Winters
Hoofd Administratief Officier bij Vertical Circuits, Inc.
Actieve functies van Patty Winters
Bedrijven | Functie | Begin | Einde |
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Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Hoofd Administratief Officier | 01-01-2004 | - |
Human Resources Officer | 01-01-2004 | - |
Loopbaan van Patty Winters
Eerdere bekende functies van Patty Winters
Bedrijven | Functie | Begin | Einde |
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Parallax Medical, Inc. | Operationeel Directeur | 01-01-2000 | 01-01-2003 |
Statistieken
Internationaal
Verenigde Staten | 3 |
Operationeel
Chief Administrative Officer | 1 |
Human Resources Officer | 1 |
Chief Operating Officer | 1 |
Sectoraal
Electronic Technology | 2 |
Beklede functies
Actief
Inactief
Beursgenoteerde bedrijven
Bedrijven in privébezit
Verwante bedrijven
Bedrijven in privébezit | 2 |
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Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
Parallax Medical, Inc. |
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